Aquabond 85 slicing and dicing magnets.
|Single Crystal Boules
Aquabond 85 slabbing sapphire, garnet and other hard materials.
|Dicing 1.4mm thin film filters
Aquabond 850 and 65 slicing dicing filters.
|Grinding and Polishing Compound Wafers
Silicon wafer applied to a puck with Aquabond 55 for grinding.
|Dicing coated single crystal material
Isolators diced using Aquabond 85. Bottom side chipouts <5um
Debonding of parts after cutting or machining is accomplished using hot water and an Aquaclean water based cleaning agent, often accompanied by ultrasonic or air irrigation The use of acetone or aggressive solvents and their attendant health, fire and environmental hazards is eliminated.
No Waste Requirements
With proper approvals, the spent cleaning solution can be sewer discharged. The Aquabond adhesive system is unique in this respect.
Improved Quality and Yields
High hardness and shear strength improves precision machining operations creating less attrition.
Environmentally Friendly and Cost Effective
Following a simple debonding process using the aqueous cleaning agent, you will find your parts are much cleaner than using a typical thermoplastic stick followed by the solvent cleaning approach. Not only is the adhesive residue removed, but also oils and particles left by other areas of your process. Afterward, the cleaning solution can simply be poured down the drain. It does not need to be collected and further dealt with as hazardous
The AQUACLEAN 900 cleaning agent is a concentrated powder-form detergent designed to replace hazardous, toxic, or waste intensive materials. It is easily dissolved in aqueous cleaning systems and has been demonstrated to work well in removing a variety of materials.
|Polyester Web Reinforcement:|
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|Water Solubility @ 80C, %:|
|*Use of ultrasonic or injected air cleaning speeds debonding in all systems|